HP Inc. filed 195 H-1B LCAs in FY2023. Average salary: $117k.
During fiscal year FY2023, HP Inc. submitted 195 H-1B labor condition applications at an average compensation of $117k. Top positions include Software Applications Engineer (9%), Research Engineer (4%), Software Firmware Engineer (4%). Filings were concentrated in Texas (42%), California (23%), Washington (16%). The certification rate was 100%. Salaries ranged from $62k to $203k.
| Percentile | Salary |
|---|---|
| 10th | $83k |
| 25th | $96k |
| 50th (Median) | $116k |
| 75th | $133k |
| 90th | $151k |
Based on 195 salary records. Range: $62k – $203k.
0% of filings offer salaries above the prevailing wage, with an average premium of 0%. The average prevailing wage is $117k (based on 195 filings).
Average processing time is 7 days (median: 7 days). Fastest: 7 days, slowest: 8 days. Based on 195 filings.
58% of filings are for new positions, while 27% are for continued employment (195 filings).
Average contract duration: 36 months (median: 36 months), based on 195 filings.
| Visa Class | Filings |
|---|---|
| H-1B | 191 |
| E-3 AUSTRALIAN | 4 |
| Education Level | Filings |
|---|---|
| Not Specified | 195 |
| Job Title | Filings |
|---|---|
| Software Applications Engineer | 18 |
| Research Engineer | 8 |
| Software Firmware Engineer | 8 |
| Software Quality Assurance Engineer | 6 |
| PSS Life Cycle Marketing Manager | 6 |
| Data Engineer | 5 |
| Electrical/Hardware Engineer | 5 |
| IT Engineer | 4 |
| Cybersecurity | 4 |
| Industrial Design Engineer | 4 |
HP Inc. filed 195 H-1B Labor Condition Applications (LCAs) in FY2023.
The average H-1B salary at HP Inc. in FY2023 was $117k.
The top H-1B job titles sponsored by HP Inc. in FY2023 include Software Applications Engineer, Research Engineer, Software Firmware Engineer.