Smith & Nephew, Inc. filed 53 H-1B LCAs in FY2025. Average salary: $130k.
Smith & Nephew, Inc. sponsored 53 H-1B positions during the FY FY2025 cycle, offering an average of $130k. Top positions include Packaging Engineer 3-KBGFJG106971-9 (6%), Senior Operational Technology Engineer - KBGFJG366771-1 (4%), Lead Solution Architect -KBGFJG166142-5 (4%). Filings were concentrated in Pennsylvania (30%), Massachusetts (25%), Tennessee (25%). The certification rate was 98%. Salaries ranged from $72k to $209k.
| Percentile | Salary |
|---|---|
| 10th | $93k |
| 25th | $108k |
| 50th (Median) | $124k |
| 75th | $151k |
| 90th | $175k |
Based on 53 salary records. Range: $72k – $209k.
89% of filings offer salaries above the prevailing wage, with an average premium of 20.3%. The average prevailing wage is $110k (based on 53 filings).
Average processing time is 7 days (median: 7 days). Fastest: 7 days, slowest: 10 days. Based on 52 filings.
17% of filings are for new positions, while 53% are for continued employment (53 filings).
Average contract duration: 36 months (median: 36 months), based on 53 filings.
| Visa Class | Filings |
|---|---|
| H-1B | 52 |
| E-3 AUSTRALIAN | 1 |
| Education Level | Filings |
|---|---|
| Not Specified | 53 |
| Job Title | Filings |
|---|---|
| Packaging Engineer 3-KBGFJG106971-9 | 3 |
| Senior Operational Technology Engineer - KBGFJG366771-1 | 2 |
| Lead Solution Architect -KBGFJG166142-5 | 2 |
| Biologics Account Manager - KBGFJG375758-1 | 1 |
| Manufacturing Engineer II - Blades - KBGFJG226837-4 | 1 |
| Sr. Security DevOps Engineer - KBGFJG106563-8 | 1 |
| Lead IT Business Analyst, Customer Solution - KBGFJG222217-7 | 1 |
| Senior Supplier Quality Engineer - KBGFJG131554-11 | 1 |
| R&D Engineer -Software - KBGFJG372992-1 | 1 |
| Senior R&D Engineer Software DevOps Engineering KBGFJG223974 | 1 |
Smith & Nephew, Inc. filed 53 H-1B Labor Condition Applications (LCAs) in FY2025.
The average H-1B salary at Smith & Nephew, Inc. in FY2025 was $130k.
The top H-1B job titles sponsored by Smith & Nephew, Inc. in FY2025 include Packaging Engineer 3-KBGFJG106971-9, Senior Operational Technology Engineer - KBGFJG366771-1, Lead Solution Architect -KBGFJG166142-5.